![]() Mayer, J., Mader, W., Knauss, D., Ernst, F. Ishida, Studies in Physical and Theoretical Chemistry, Elsevier, 1987, 48, 3.īurger, K., Mader, W. Nicholas, M.G., “Fondamentals of diffusion bonding”, Ed. Nicholas, M.G., Science of Ceramics 5, published by Swedish Institute for Silicate Research, 1970, 214 ![]() Ishida - Studies in Physical and Theoretical Chemistry, Elsevier, 1987, 48, 3. Klomp, J.T., “Fondamentals of diffusion bonding”, Ed. N☂, 131.Ĭhatain, D., Rivollet, I., and Eustathopoulos, N., J. This process is experimental and the keywords may be updated as the learning algorithm improves.īorbidge, W.E., Allen, R.V. These keywords were added by machine and not by the authors. ![]() High resolution electron microscopy (HREM) shows that the twin plane and the glide plane coincide with a copper plane. Dislocations and twins are present, they are running parallel to the basal plane. The microstructural defects of this intermediar oxide have been investigated. This oxide shows a particular orientation with respect to the interface: the basal plane of its crystallographic structure is always laying parallel to the interface plane. As a consequence of these treatments, the binary oxide CuAlO 2 is produced at the interface. Oxidized copper and alumina sheets have ben bonded using two procedures: solid state bonding and liquid state bonding by the eutectic method. In the course of a general investigation of the particular case of the copper-alumina bonding Transmission Electron Microscopy (TEM) has been used to follow the interfacial reactions through a detailed characterization of compounds at the metal-ceramic interface.
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